Adding aluminum nitride powder to resin or plastic can significantly improve thermal conductivity

Aluminum nitride has high thermal conductivity and electrical insulation. Adding aluminum nitride powder to resin or plastic can significantly improve thermal conductivity.

Adding aluminum nitride powder to resin or plastic can significantly improve thermal conductivity

Because of its excellent thermal, electrical and mechanical properties. Aluminum nitride ceramics have attracted widespread attention from researchers at home and abroad. With the rapid development of modern science and technology, higher requirements have been placed on the properties of the materials used. Aluminum nitride ceramics will also be more widely used in many fields! Despite the unremitting efforts of many researchers over the years, great progress has been made in the research of powder preparation, forming, and sintering. However, as of April 2013, the commercialization of aluminum nitride is not high, which is also a key factor affecting the further development of aluminum nitride ceramics. In order to promote the further development of aluminum nitride research and application, the following two research tasks must be done. Research on low-cost powder preparation technology and methods. The main factor restricting the commercialization of aluminum nitride is the price issue. If aluminum nitride powder can be prepared at a lower cost, its commercialization will be greatly improved! High-temperature self-propagating method and low-temperature carbothermic reduction synthesis process are promising powder synthesis methods. Both have the characteristics of low cost and suitable for large-scale production! Research on the net near forming technology of complex-shaped aluminum nitride ceramic parts, such as injection molding technology. It is of great significance to give full play to the performance advantages of aluminum nitride and broaden its application range.

Ceramic spherical aluminum nitride was first synthesized in 1877. In the 1980s, AlN ceramic microspheres, as ceramic insulators, were widely used in the field of microelectronics due to their high heat transfer. Unlike beryllium oxide, AlN ceramic microspheres are non-toxic. Ceramic spherical aluminum nitride is treated with metal and can be used as a substitute for aluminum oxide and beryllium oxide in a large number of electronic instruments. Spherical ceramic aluminum nitride can be made by reducing aluminum oxide and carbon or directly nitriding metal aluminum. Aluminum nitride ceramic microspheres are a material connected by covalent bonds. It has a hexagonal crystal structure and has the same shape as zinc sulfide and wurtzite. Industrial grade materials can only be made by hot pressing and welding. This material is very stable in an inert high temperature environment.

Overview of Aluminum Nitride AlN Ceramic Microspheres

AIN crystals are covalently bonded compounds with 〔AIN4〕 tetrahedron as the structural unit, which has a wurtzite-type structure and belongs to the hexagonal crystal system. Chemical composition AI 65.81%, N 34.19%, specific gravity 3.261g/cm3, white or off-white, colorless and transparent single crystal, sublimation decomposition temperature under normal pressure is 2450℃. It is a high-temperature heat-resistant material. Coefficient of thermal expansion (4.0-6.0) X10-6/℃. The thermal conductivity of polycrystalline AIN is 260W/(m.k), which is 5-8 times higher than alumina, so it has good thermal shock resistance and can withstand extreme heat at 2200℃. In addition, aluminum nitride has the characteristics of not being corroded by molten aluminum, other molten metals and gallium arsenide, and especially has excellent corrosion resistance to molten aluminum.

Application of Aluminum Nitride AlN Ceramic Microspheres

1. Aluminum nitride powder has high purity, small particle size and high activity. It is the main raw material for manufacturing high thermal conductivity aluminum nitride ceramic substrates.

2. Aluminum nitride ceramic substrate has high thermal conductivity, low expansion coefficient, high strength, high temperature resistance, chemical corrosion resistance, high resistivity, and low dielectric loss. It is an ideal large-scale integrated circuit heat dissipation substrate and packaging material.

3.Aluminum nitride has high hardness, which is higher than that of traditional alumina.It is a new type of wear-resistant ceramic material.

4. Utilizing the heat resistance, melt erosion resistance and thermal shock resistance of AIN ceramics, GaAs crystal crucibles, Al evaporating dishes, magnetic fluid power generation devices, and high temperature turbine corrosion-resistant parts can be made, and its optical properties can be used as infrared windows. Aluminum nitride film can be made into high-frequency piezoelectric components, ultra-large-scale integrated circuit substrates, etc.

5. Aluminum nitride is heat-resistant, resistant to corrosion by molten metal, stable to acid, but easily corroded in alkaline solution. The new surface of AIN will react when exposed to humid air to form a very thin oxide film. Using this feature, it can be used as a crucible and casting mold material for melting aluminum, copper, silver, lead and other metals. AIN ceramics have good metallization properties and can replace toxic beryllium oxide ceramics and are widely used in the electronics industry.

Aluminum Nitride AlN Ceramic Microsphere Price

The price of aluminum nitride AlN ceramic microspheres will vary randomly with factors such as production costs, transportation costs, international conditions, exchange rates, and market supply and demand for aluminum nitride AlN ceramic microspheres. Tanki New Materials Co., Ltd. aims to help various industries and chemical wholesalers find high-quality, low-cost nanomaterials and chemicals by providing a full set of customized services. If you are looking for aluminum nitride AlN ceramic microspheres, please feel free to send an inquiry to get the latest price of aluminum nitride AlN ceramic microspheres.

Supplier of Aluminum Nitride AlN Ceramic Microspheres

As a global supplier of aluminum nitride AlN ceramic microspheres, Tanki New Materials Co., Ltd. has extensive experience in the performance, application and cost-effective manufacturing of advanced engineering materials. The company has successfully developed a series of powder materials (molybdenum disilicide, lanthanum nitride (LaN powder, calcium silicide, iron boride), high-purity targets, functional ceramics and structural devices, and provides OEM services.

Aluminum Nitride Microsphere Properties
Other NamesAluminium nitride
CAS No.24304-00-5
Compound FormulaAlN
Molecular Weight40.9882
AppearanceWhite to pale yellow powder
Melting Point2200 °C
Boiling Point2517 °C (dec.)
Density2.9 to 3.3 g/cm3
Solubility in H2ON/A
Electrical Resistivity10 to 12 10x Ω-m
Poisson's Ratio0.21 to 0.31
Specific Heat780 J/kg-K
Thermal Conductivity80 to 200 W/m-K
Thermal Expansion4.2 to 5.4 µm/m-K
Young's Modulus330 GPa
Exact Mass40.9846
Monoisotopic Mass40.9846
Aluminum Nitride Microsphere Health & Safety Information
RemarksDanger
Hazard StatementsH314-H335
Hazard CodesXi
Risk Codes36/37/38
Safety Statements26-37/39
RTECS NumberN/A
Transport InformationN/A
WGK Germany3

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